ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,581, issued on Sept. 22, was assigned to Canon K.K. (Tokyo). "Wafer dicing method and liquid ejection head" was invented by Takashi Teraga... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,582, issued on Sept. 22, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Method of cleaning silicon wafer, method of manufacturing s... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,583, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,584, issued on Sept. 22, was assigned to HANWHA PRECISION MACHINERY Co. LTD. (Changwon-si, South Korea). "Modularized bonding apparatus" w... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,585, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Wafer cleaning method and system using heated functional plate" was... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,586, issued on Sept. 22, was assigned to EBARA Corp. (Tokyo). "Substrate processing method and substrate processing apparatus" was invente... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,587, issued on Sept. 22, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Apparatus for treating substrate" was invented by Jun ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,588, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Processing method and processing system" was invented by Hayato Tan... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,589, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Information processing system, power adjustment method, and heat tr... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,590, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was... Read More